We use state-of-the-art equipments dedicated to III-Nitrides processing compatible with 2″ and 4″ wafers

2

Minimum Pattern Size

500

Alignement Precision

5000

Maximum Device Size

From the simplest process to the most sophisticated device

Deep Mesa Etching
Controlled edge surfaces
compatible with microLED

Submicron precision alignement for the most extreme device architecture

From millimeter size down to micron scale devices and below

Mass-transfer process for microLED and LED matrix

From millimeter size down to micron scale devices

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