We use state-of-the-art equipments dedicated to III-Nitrides processing compatible with 2″ and 4″ wafers

 

 

2

Minimum Pattern Size

500

Alignement Precision

10

Maximum Device Size

From the simplest process to the most sophisticated device

Deep Mesa Etching
Controlled edge surfaces
compatible with microLED

Submicron precision alignement for the most extreme device architecture

From millimeter size down to micron scale devices and below

The Future Is Now

In order to respond to the future requirements of optoelectronic devices we are developing a mass-transfer process which is compatible with the fabrication of microLED matrices.

The process will offer drastic cost reduction by allowing substrate recycling.

Mass-transfer process for microLED and LED matrix