2
Minimum Pattern Size
500
Alignement Precision
10
Maximum Device Size
From the simplest process to the most sophisticated device
Deep Mesa Etching
Controlled edge surfaces
compatible with microLED
Submicron precision alignement for the most extreme device architecture
From millimeter size down to micron scale devices and below
The Future Is Now
In order to respond to the future requirements of optoelectronic devices we are developing a mass-transfer process which is compatible with the fabrication of microLED matrices.
The process will offer drastic cost reduction by allowing substrate recycling.
